Description: Microstructure and aging resistance of the joints between SAC305 solder and thermoelectric materials with different diffusion barriers

Bibliographic Details
Main Authors:	Cheng, F. J. (Author), Ma, Z. L. (Author), Wang, Y. (Author), Zhang, G. X. (Author), Long, W. M. (Author)
Format:	Article
Language:	English
Subjects:	spájkované spoje termoelektrické materiály odolnosť proti starnutiu
Online Access:	http://kovmat.sav.sk/abstract.php?rr=52&cc=3&ss=157
Source:	1. Kovové materiály 1. Roč. 52, č. 3 (2014), s. 157-162 1. 1338-4252