Identification of phases in Sn-Ag-Cu-In solder on Cu substrate interface

by Šebo, P., Švec, P., Janičkovič, D., Moser, Z.
Source: 1. Kovové materiály 1. 0023-432X 1. Roč. 46, č. 4 (2008), s. 235-238

Comparison of mechanical properties and microstructure of lead-free solders and soldered joints

by Martinkovič, M., Drienovský, M.
Source: 1. Acta metallurgica slovaca conference : Metallography 2010 1. Č. 1 (2010), s. 277-280 1. 1338-1660

High-temperature shear strength and hardness of cast lead-free solders

by Mahmudi, R., Maraghi, A., Geranmayeh, A. R.
Source: 1. Kovové materiály 1. Roč. 55, č. 3 (2017), s. 211-216 1. 1338-4252 (online) 1. 0023-432X (tlač)