Liquid-liquid structure transition and its effect on solidification of Sn-Sb alloy

by Li, X.-F, Hu, C.-M, Zu, F.-Q, Huang, Z.-Y., Mao, L.-N, Liu, Y.-C.
Source: 1. Kovové materiály 1. 0023-432X 1. Roč. 47, č. 2 (2009), s. 109-113

Change of solidification behaviors in the superheating Sn-40wt.%Bi alloy from the viewpoint of the relaxation of properties

by Ding, G., Li, X., Chen, H.
Source: 1. Kovové materiály 1. Roč. 50, č. 4 (2012), s. 251-257 1. 1338-4252

Change of solidification behaviors in the superheating Sn-40wt.%Bi alloy from the viewpoint of the relaxation of properties

by Ding, G., Li, X., Chen, H.
Source: 1. Kovové materiály 1. Roč. 50, č. 4 (2012), s. 251-257 1. 1338-4252

Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders

by Rudajevova, A., Dušek, K.
Source: 1. Kovové materiály 1. Roč. 50, č. 5 (2012), s. 295-300 1. 1338-4252

Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders

by Rudajevova, A., Dušek, K.
Source: 1. Kovové materiály 1. Roč. 50, č. 5 (2012), s. 295-300 1. 1338-4252

High-temperature shear strength and hardness of cast lead-free solders

by Mahmudi, R., Maraghi, A., Geranmayeh, A. R.
Source: 1. Kovové materiály 1. Roč. 55, č. 3 (2017), s. 211-216 1. 1338-4252 (online) 1. 0023-432X (tlač)