Microstructure and aging resistance of the joints between SAC305 solder and thermoelectric materials with different diffusion barriers

by Cheng, F. J., Ma, Z. L., Wang, Y., Zhang, G. X., Long, W. M.
Source: 1. Kovové materiály 1. Roč. 52, č. 3 (2014), s. 157-162 1. 1338-4252

Microstructure and aging resistance of the joints between SAC305 solder and thermoelectric materials with different diffusion barriers

by Cheng, F. J., Ma, Z. L., Wang, Y., Zhang, G. X., Long, W. M.
Source: 1. Kovové materiály 1. Roč. 52, č. 3 (2014), s. 157-162 1. 1338-4252

Electronic, magnetic, and electric transport properties of Ce3Co4Sn13 and Ce3Rh4Sn13: a comparative study

by Ślebarski, A., Fijałkowski, M., Goraus, J., Maple, M. B.
Call Number: III.228989

Source: 1. 15 th Czech and Slovak Conference on Magnetism CSMAG´13 1. Košice : Pavol Jozef Šafárik University in Košice 1. S. 268 1. 9788081520150