Effect of liquid-liquid transition on solidification and wettability of Sn-0.7Cu-xBi solder

by Li, X. F., Hao, X. M., Zhang, F., Zu, F. Q., Zhou, W.
Source: 1. Kovové materiály 1. Roč. 54, č. 3 (2016), s. 205-210 1. 1338-4252