Description: Influence of indium and copper in Sn3.5Ag0.4CuIn solder on its interaction with copper

Bibliographic Details
Main Authors:	Šebo, P. (Author), Švec, P. (Author), Janičkovič, D. (Author), Illeková, E. (Author)
Format:	Article
Language:	English
Subjects:	bezolovnaté spájkovanie spájky Cu indium
Source:	1. Kovové materiály 1. 0023-432X 1. Roč. 47, č. 4 (2009), s. 275-282