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LEADER |
01073nab#a2200397#ar4500 |
001 |
000099698 |
003 |
SVKKK |
005 |
20100302104347.0 |
008 |
100302c2009 xo |||||||||||||||b|eng |
FMT |
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|
015 |
|
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|a SNBRB2010/03
|
038 |
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|a SVKKK
|
040 |
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|a SVKKK
|b slo
|e AACR2
|
041 |
0 |
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|a eng
|b eng
|
044 |
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|a xo
|c SK
|
080 |
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|a 621.791.35
|2 1997
|
242 |
1 |
0 |
|a Vplyv india a medi v spájke Sn3.5Ag0.4CuIn na jej interakciu s meďou
|
245 |
1 |
0 |
|a Influence of indium and copper in Sn3.5Ag0.4CuIn solder on its interaction with copper
|c P. Šebo ... [et al.]
|
300 |
|
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|b Obr., tab.
|
504 |
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|a Bibliogr. odkazy
|
504 |
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|a Res. angl.
|
650 |
0 |
4 |
|a bezolovnaté spájkovanie
|
650 |
0 |
4 |
|a spájky Cu
|
650 |
0 |
4 |
|a indium
|
700 |
1 |
|
|a Šebo, P.
|4 aut
|
700 |
1 |
|
|a Švec, P.
|4 aut
|
700 |
1 |
|
|a Janičkovič, D.
|4 aut
|
700 |
1 |
|
|a Illeková, E.
|4 aut
|
773 |
0 |
|
|t Kovové materiály
|x 0023-432X
|g Roč. 47, č. 4 (2009), s. 275-282
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958 |
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|a NB
|
974 |
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|a Ma
|
992 |
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|a RBX
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BAS |
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|
852 |
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|a SVKKK
|b BIB
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EXP |
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|
998 |
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|a HUT
|