Wafer scale integration 3. : Proceedings of the 3 IFIP WG 10.5 workshop on wafer scale... Como,Italy, 6-8 June 1989. /
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| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
Amsterdam-New York-Oxford :
North-Holland Publishing Co.,
1990
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| Edition: | 1. vyd. |
| Subjects: | |
| ISBN: |
0444884963 (viaz.) |
| Physical Description: |
402 s. |
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