Budúcnosť spájkovania bez olova = Future of lead-free soldering

Bibliographic Details
Main Authors: Šebo, Pavol (Author), Janíčkovič, Dušan (Author), Švec, Peter (Author)
Format: Article
Language:Slovak
Subjects:
Source: 1. Zváranie 1. 0044-5525 1. Roč. 54, č.3 (2005), s. 82-84
Description
Physical Description:Obr.
Bibliography:Res. angl., slov.
ISSN:0044-5525