Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Subjects: | |
| Online Access: | http://www.kovmat.sav.sk/abstract.php?rr=50&cc=5&ss=295 |
| Source: |
1. Kovové materiály 1. Roč. 50, č. 5 (2012), s. 295-300 1. 1338-4252 |
| Physical Description: | Obr., tab. |
|---|---|
| Bibliography: | Bibliogr. odkazy Res. angl. |
| ISSN: | 1338-4252 |