Description: Influence of melt overheating on microstructure and soldering properties of SnBiCu solder alloy

Bibliographic Details
Main Authors:	Chen, Z. H. (Author), Bao, X. D. (Author), Huang, Z. J. (Author), Wang, G. (Author), Zhu, X. B. (Author), Sun, Y. F. (Author)
Format:	Article
Language:	English
Subjects:	spájky SnBiCu štruktúra taveniny solidifikácia mikroštruktúra
Online Access:	http://www.kovmat.sav.sk/abstract.php?rr=53&cc=2&ss=79
Source:	1. Kovové materiály 1. Roč. 53, č. 2 (2015), s. 79-84 1. 1338-4252