Effect of liquid-liquid transition on solidification and wettability of Sn-0.7Cu-xBi solder

Bibliographic Details
Main Authors: Li, X. F. (Author), Hao, X. M. (Author), Zhang, F. (Author), Zu, F. Q. (Author), Zhou, W. (Author)
Format: Article
Language:English
Subjects:
Online Access:http://www.kovmat.sav.sk/abstract.php?rr=54&cc=3&ss=205
Source: 1. Kovové materiály 1. Roč. 54, č. 3 (2016), s. 205-210 1. 1338-4252
Description
Physical Description:Obr., tab.
Bibliography:Bibliogr. odkazy
ISSN:1338-4252